# Electronics

[Canonical HTML page](https://jpscm.com/applications/electronics)

Woven glass fabrics for printed circuit boards, copper-clad laminates, and IC package substrates.

[Discuss your application](https://jpscm.com/contact)

## Glass fabrics for circuit boards and IC substrates

From printed circuit board–copper clad laminates (PCB-CCL) to IC package substrates, JPS woven glass fabrics reinforce electronic systems. E-glass provides mechanical strength and dimensional stability, Low Dk glass addresses dielectric performance, and L-HDI glass addresses low thermal expansion in advanced packaging. Fabric construction and finish are selected for the laminate, resin system, and processing requirements.

## Electronics fabric capabilities

### PCB-CCL & IC substrates

Woven glass reinforcement for circuit-board laminates and advanced IC packaging.

### Spread and C&C

Spread glass and C&C (cut and coat) capabilities for electronic fabric constructions.

### Low Dk & L-HDI glass

Low dielectric constant glass for signal performance; low CTE glass for package stability.

### IPC-certified styles

Fabric styles certified to IPC-4412 and IPC-4413, with resin-compatible finish options.

## Construction, finish, and certification

### PCB and copper-clad laminate construction

Woven glass is part of the resin laminate beneath the copper circuitry. Select weave, thickness, spread, and finish together to meet laminate processing and electrical requirements. JPS can review spread and C&C (cut and coat) options for the proposed construction.

### IC package substrates and low CTE glass

L-HDI glass targets low CTE (coefficient of thermal expansion) and dimensional stability in advanced IC package substrates. Low Dk glass targets dielectric performance. These properties address different design requirements; JPS can review construction, current availability, and qualification for the intended substrate.

### IPC-4412 and IPC-4413 certified styles

JPS offers fabric styles certified to IPC-4412 for finished woven E-glass and IPC-4413 for finished woven low dielectric constant glass used in printed boards. Confirm the applicable specification, finish, and certification for the selected fabric style.

## Electronics application atlas

### Printed circuit boards & copper-clad laminates

Woven glass reinforces the resin laminate beneath copper circuitry. Fabric construction, dielectric properties, and finish help define the laminate’s processing and electrical performance.

#### Glass inside the laminate

E-glass provides mechanical reinforcement and dimensional stability in printed circuit board–copper clad laminates (PCB-CCL). Low Dk glass is an option where dielectric performance drives material selection.

- [E-glass](https://jpscm.com/products/e-glass-s-glass)
- [Low Dk glass](https://jpscm.com/products/low-dk-l-hdi-glass)

#### Low Dk glass fabrics

Low dielectric constant glass supports signal performance in electronic laminates. Select the fabric, resin system, and construction together for the board’s electrical requirements.

- [Low Dk glass](https://jpscm.com/products/low-dk-l-hdi-glass)

#### Spread and C&C capabilities

JPS offers spread glass and C&C (cut and coat) capabilities, with finishes selected for resin compatibility. Confirm the construction, processing route, and applicable IPC certification with JPS.

- [E-glass](https://jpscm.com/products/e-glass-s-glass)
- [Low Dk glass](https://jpscm.com/products/low-dk-l-hdi-glass)

### Glass fabrics for IC package substrates

Glass reinforcement supports the substrate connecting an integrated circuit to the circuit board. Thermal expansion and dimensional stability are central material-selection considerations.

#### Reinforcement beneath the IC

L-HDI glass fabrics address low thermal expansion and dimensional stability in advanced IC package substrates. Review fabric construction and qualification requirements with JPS.

- [L-HDI glass](https://jpscm.com/products/low-dk-l-hdi-glass)

#### L-HDI for low thermal expansion

Low CTE (coefficient of thermal expansion) reinforcement addresses dimensional change during thermal processing. L-HDI and Low Dk glass serve different material needs; low CTE alone does not establish low dielectric loss.

- [L-HDI glass](https://jpscm.com/products/low-dk-l-hdi-glass)

#### Match the fabric to the package

Weave, thickness, and resin-compatible finish are selected for the substrate process. Discuss spread and C&C requirements, current availability, and qualification status for the proposed construction.

- [L-HDI glass](https://jpscm.com/products/low-dk-l-hdi-glass)

## Which fabrics go where

### E-glass for PCB-CCL reinforcement

In printed circuit board–copper clad laminates (PCB-CCL), woven E-glass reinforces the resin beneath copper circuitry. JPS offers styles certified to IPC-4412, plus spread and C&C (cut and coat) capabilities. Select the fabric construction and resin-compatible finish for the laminate process.

[E-Glass & S-2 Glass®](https://jpscm.com/products/e-glass-s-glass)

### Low Dk glass fabrics for signal performance

Low Dk (low dielectric constant) glass fabrics support electrical performance in PCB and copper-clad laminates. JPS offers low dielectric glass styles certified to IPC-4413. Review the fabric, resin system, spread requirements, and finish together for the intended construction.

[Low Dk & L-HDI Glass](https://jpscm.com/products/low-dk-l-hdi-glass)

### L-HDI glass fabrics for IC package substrates

L-HDI glass addresses low thermal expansion and dimensional stability in IC package substrates. Review high-density interconnect designs, fabric construction, spread and C&C requirements, availability, and qualification status with JPS. Low CTE and Low Dk are separate material properties.

[Low Dk & L-HDI Glass](https://jpscm.com/products/low-dk-l-hdi-glass)

### Quartz for high-frequency systems

Astroquartz® fused silica fabric supports high-frequency electronics and antenna structures where dielectric behavior is a key material-selection requirement.

[Astroquartz®](https://jpscm.com/products/astroquartz)

## Discuss your application.

Contact JPS for material selection and technical support.

[Contact JPS](https://jpscm.com/contact)

## JPS film

[Electronics application motion (MP4)](https://jpscm.com/videos/markets/electronics.mp4?v=1)