Dimensional stability
Resistance to shrinkage and controlled tolerances support multilayer lamination and assembly.
Precision reinforcement fabrics for printed circuit boards, aerospace components, and advanced electronic systems.

JPS creates reinforcement fabrics for PCB substrates, aerospace components, and advanced electronics. E-glass, S-2 Glass®, quartz, aramid, and hybrid fibers provide options for strength, heat resistance, and electrical performance. Controlled weaving and finishing support dimensional consistency and resin adhesion, while fabric construction can be customized for the requirements of multilayer laminates and other demanding assemblies.
Resistance to shrinkage and controlled tolerances support multilayer lamination and assembly.
Controlled dielectric properties and low-loss fabric options support high-frequency electronics.
Material options support manufacturing heat and the thermal cycling requirements of the application.
Weave patterns, fiber orientation, and finish can be tailored for the production process.
JPS fabrics support multilayer circuit boards and high-frequency electronics, with dielectric consistency and dimensional accuracy for precision assemblies.
Reinforcement fabrics provide material options for structural and functional aerospace components exposed to demanding mechanical and thermal conditions.
Fabric construction and surface treatments can be selected for resin adhesion, lamination, and bonding. Our engineers support material selection and application-specific development.
Contact JPS to discuss material selection, fabric construction, and finishes.