PCB-CCL & IC substrates
Woven glass reinforcement for circuit-board laminates and advanced IC packaging.
Electronics
Woven glass fabrics for printed circuit boards, copper-clad laminates, and IC package substrates.
Glass fabrics for circuit boards and IC substrates
From printed circuit board–copper clad laminates (PCB-CCL) to IC package substrates, JPS woven glass fabrics reinforce electronic systems. E-glass provides mechanical strength and dimensional stability, Low Dk glass addresses dielectric performance, and L-HDI glass addresses low thermal expansion in advanced packaging. Fabric construction and finish are selected for the laminate, resin system, and processing requirements.
Inside the laminate.
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Illustrative laminate layers. Fabric previews represent material families.
Application 01
Glass inside the laminate
E-glass provides mechanical reinforcement and dimensional stability in printed circuit board–copper clad laminates (PCB-CCL). Low Dk glass is an option where dielectric performance drives material selection.
All applications and fabric options
Printed circuit boards & copper-clad laminates
Woven glass reinforces the resin laminate beneath copper circuitry. Fabric construction, dielectric properties, and finish help define the laminate’s processing and electrical performance.
E-glass provides mechanical reinforcement and dimensional stability in printed circuit board–copper clad laminates (PCB-CCL). Low Dk glass is an option where dielectric performance drives material selection.
E-glass · Low Dk glassLow dielectric constant glass supports signal performance in electronic laminates. Select the fabric, resin system, and construction together for the board’s electrical requirements.
Low Dk glassJPS offers spread glass and C&C (cut and coat) capabilities, with finishes selected for resin compatibility. Confirm the construction, processing route, and applicable IPC certification with JPS.
E-glass · Low Dk glass
Glass fabrics for IC package substrates
Glass reinforcement supports the substrate connecting an integrated circuit to the circuit board. Thermal expansion and dimensional stability are central material-selection considerations.
L-HDI glass fabrics address low thermal expansion and dimensional stability in advanced IC package substrates. Review fabric construction and qualification requirements with JPS.
L-HDI glassLow CTE (coefficient of thermal expansion) reinforcement addresses dimensional change during thermal processing. L-HDI and Low Dk glass serve different material needs; low CTE alone does not establish low dielectric loss.
L-HDI glassWeave, thickness, and resin-compatible finish are selected for the substrate process. Discuss spread and C&C requirements, current availability, and qualification status for the proposed construction.
L-HDI glass
Electronics fabric capabilities
Spread and C&C
Spread glass and C&C (cut and coat) capabilities for electronic fabric constructions.
Low Dk & L-HDI glass
Low dielectric constant glass for signal performance; low CTE glass for package stability.
IPC-certified styles
Fabric styles certified to IPC-4412 and IPC-4413, with resin-compatible finish options.
Construction, finish, and certification
PCB and copper-clad laminate construction
Woven glass is part of the resin laminate beneath the copper circuitry. Select weave, thickness, spread, and finish together to meet laminate processing and electrical requirements. JPS can review spread and C&C (cut and coat) options for the proposed construction.
IC package substrates and low CTE glass
L-HDI glass targets low CTE (coefficient of thermal expansion) and dimensional stability in advanced IC package substrates. Low Dk glass targets dielectric performance. These properties address different design requirements; JPS can review construction, current availability, and qualification for the intended substrate.
IPC-4412 and IPC-4413 certified styles
JPS offers fabric styles certified to IPC-4412 for finished woven E-glass and IPC-4413 for finished woven low dielectric constant glass used in printed boards. Confirm the applicable specification, finish, and certification for the selected fabric style.
Which fabrics go where
E-glass for PCB-CCL reinforcement
In printed circuit board–copper clad laminates (PCB-CCL), woven E-glass reinforces the resin beneath copper circuitry. JPS offers styles certified to IPC-4412, plus spread and C&C (cut and coat) capabilities. Select the fabric construction and resin-compatible finish for the laminate process.
Low Dk glass fabrics for signal performance
Low Dk (low dielectric constant) glass fabrics support electrical performance in PCB and copper-clad laminates. JPS offers low dielectric glass styles certified to IPC-4413. Review the fabric, resin system, spread requirements, and finish together for the intended construction.
L-HDI glass fabrics for IC package substrates
L-HDI glass addresses low thermal expansion and dimensional stability in IC package substrates. Review high-density interconnect designs, fabric construction, spread and C&C requirements, availability, and qualification status with JPS. Low CTE and Low Dk are separate material properties.
Quartz for high-frequency systems
Astroquartz® fused silica fabric supports high-frequency electronics and antenna structures where dielectric behavior is a key material-selection requirement.
Discuss your application.
Contact JPS for material selection and technical support.